Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy

Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotropic version of EPO-TEK®E4110, suggested for applications requiring a screen printing process as well as jetting.

Advantages & Application Notes:

• A thixotropic paste which enables ultra-fine pitch applications at the wafer or PCB/substrate packaging level. It may be dispensed, printed or jetted.
• Semiconductor Flip Chip Suggested Applications:
  • Flip Chip attaching of IC’s direct to substrate or in semiconductor advanced plastic packages.
  • “Dots” of E4110-PFC may be realized at 75µm diameter and 125µm pitch.
  • Compatible with screen printing processes, whether mesh or stencil foils. The former requires > 200 mesh wires while the latter should be laser etched SST foil.
  • Capable of curing at temperatures as low as 45°C for solder replacement.
• Medical Suggested Applications:
  • Electrically conductive bridge when bonding Au-plated piezo-ceramic arrays to PCBs, used in ultrasonic devices.
  • Flip chip attachment of photo-detector arrays found in X-ray and CT detectors
• Opto-electronics Suggested Applications
• Electrically conductive adhesive found in sensor and fiber optic devices
• Electrical bridge of ITO contact pads to PCBs found in LCD/Displays and OLED’s

Flex Circuits suggested Applciations.

• Solar / Photo-voltaic. Adhesive for electrically back-contacting, thin film, organic and dye sensitized solar cells.
• Flip Chip adhesive dots bridging RFID chips to antennae, or smart card IC packaging.
• Electrical bridge of Au/PZT arrays to Au/Kapton found on ink-jetting circuits

Information Provided by Epoxy Technology

物理性能	额定值 (公制)	额定值 (英制)	测试方法
比重	g/cc	g/cc	Part B
	g/cc	g/cc	Part A
粒径	<= µm	<= µm
粘度	cP @Temperature 23.0 °C	cP @Temperature 73.4 °F	5 rpm

化学性能	额定值 (公制)	额定值 (英制)	测试方法
Ionic Impurities - Na (Sodium)	ppm	ppm
Ionic Impurities - K (Potassium)	ppm	ppm
Ionic Impurities - Cl (Chloride)	ppm	ppm

机械性能	额定值 (公制)	额定值 (英制)	测试方法
肖氏硬度 (邵氏 D)
拉伸模量	GPa	ksi	Storage
剪切强度	MPa	psi	Lap
	>= MPa	>= psi	Die

电气性能	额定值 (公制)	额定值 (英制)	测试方法
体积电阻率	<= ohm-cm	<= ohm-cm

热性能	额定值 (公制)	额定值 (英制)	测试方法
线性热膨胀系数	µm/m-°C	µin/in-°F	Below Tg
	µm/m-°C	µin/in-°F	Above Tg
导热系数	W/m-K	BTU-in/hr-ft²-°F
最高工作温度, Air	°C	°F	Continuous
	°C	°F	Intermittent
最低工作温度, Air	°C	°F	Continuous
	°C	°F	Intermittent
玻璃化转变温度，Tg	>= °C	>= °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
分解温度	°C	°F	Degradation Temperature; TGA

加工性能	额定值 (公制)	额定值 (英制)	测试方法
固化时间	min @Temperature 120 °C	hour @Temperature 248 °F	Minimum Bond Line
	min @Temperature 80.0 °C	hour @Temperature 176 °F	Minimum Bond Line
	min @Temperature 45.0 °C	hour @Temperature 113 °F	Minimum Bond Line
适用期	min	min
保质期	Month @Temperature 25.0 °C	Month @Temperature 77.0 °F

材料描述		测试方法
颜色	Silver	Part A
	Silver	Part B
Consistency	Smooth thixotropic paste
Ionic Impurities NH4	20 ppm
Mix Ratio By Weight	3:1
Number of Components	Two
Thixotropic Index	3.3
Weight Loss	0.37%	200°C
	0.88%	250°C
	1.38%	300°C