Aptek 2710A/B Low modulus silicone adhesive

Low modulus silicone adhesive; -110ºC to 260ºC operating range; Low outgassing/space grade; Electrostatically Discharging (ESD)
APTEK 2710-A/B is a two component, black, low modulus, thixotropic, silicone adhesive displaying very low temperature flexibility and good physical strength properties. APTEK 2710-A/B has been designed to fully cure at room temperature and can be accelerated with a brief low temperature cure. This 100% solid system has been manufactured with highly pure resins to minimize the occurrence of ionic contamination without outgassing during cure or service.

Utilizes silicone technology providing very low Tg for excellent low temperature performance; Convenient 1:1 PBW or PBV mix ration for easy handling - ideal for cartridge dispensers/repair kits; Very flexible/low modulus over wide temperature range to absorb stress build-up during thermal cycling; Very good adhesion to various substrates when used in conjunction with APTEK P-105 primer

Information provided by Aptek Laboratories, Inc.

物理性能	额定值 (公制)	额定值 (英制)	测试方法
密度	g/cc	lb/in³	A Component; ASTM D1475
	g/cc	lb/in³	B Component; ASTM D1475
Outgassing - Total Mass Loss			Cured property; at 10E-6 torr; ASTM D595
Collected Volatile Condensable Material			Cured property; at 10E-6 torr; ASTM D595

机械性能	额定值 (公制)	额定值 (英制)	测试方法
肖氏硬度 (邵氏 A)			Cured property; ASTM D1002
粘合强度	MPa	psi	Al-to-Al Lap Shear; Cured property; bondline thickness on primed aluminum panels; ASTM D1002

电气性能	额定值 (公制)	额定值 (英制)	测试方法
体积电阻率	ohm-cm	ohm-cm	Cured property; HSC 51113

热性能	额定值 (公制)	额定值 (英制)	测试方法
最高工作温度, Air	°C	°F
最低工作温度, Air	°C	°F
玻璃化转变温度，Tg	°C	°F	Cured property; TMA
Flash Point	>= °C	>= °F	A Component; ASTM D92
	>= °C	>= °F	B Component; ASTM D92

加工性能	额定值 (公制)	额定值 (英制)	测试方法
加工温度	°C	°F	Cure 1 hrs
	°C	°F	Cure 0.25 hrs