Aptek 6505PMF Electronic-grade, non-conductive adhesive

APTEK 6506-PMF is a one component, 100% solid, mineral-filled epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards as well as a protective barrier underneath epoxy overmolded devices. APTEK 6505-PMF displays excellent adhesion to various metal, ceramic, and PC board substrates.

Long RT pot life/snap heat cure-ideal for automated systems; High purity resin system for minimum level of ionic contamination to prevent corrosion problems; Smooth, highly thixotropic consistency for machine stamping and syringe dispensing applications. Holds its shape during heat cure for component stacking applications; Capable of cure at 80ºC to minimize harmful heat-sensitive components; Changes colors when gelation occurs-takes the guess work out of knowing when the material is gelled; Lower Tg version available in various size syringes and alternative containers to meet application requirements

Information provided by Aptek Laboratories, Inc.

物理性能	额定值 (公制)	额定值 (英制)	测试方法
密度	g/cc	lb/in³	ASTM D1475
粘度	cP	cP	(#7spindle/10 rpm)

机械性能	额定值 (公制)	额定值 (英制)	测试方法
肖氏硬度 (邵氏 D)			Cured property; ASTM D2240
粘合强度	MPa	psi	Al-to-Al Lap Shear; Cured property; ASTM D1002

电气性能	额定值 (公制)	额定值 (英制)	测试方法
体积电阻率	ohm-cm	ohm-cm	Cured property; ASTM D257

热性能	额定值 (公制)	额定值 (英制)	测试方法
Flash Point	>= °C	>= °F	ASTM D92

加工性能	额定值 (公制)	额定值 (英制)	测试方法
加工温度	°C	°F	Cure 1.5 hrs
	°C	°F	Cure 0.75 hrs