| Plastication: 50rpmBack Pressure (gauge): slightInjection Pressure: set to give 5 to 15 sec injection timeHold Pressure: 1/2 of injection pressureCure Time, 0.125 in: 40 secThe value listed as Thermal Conductivity, ASTM C177, was tested in accordance with ASTM F433.Resin Isomer, DAP: OrthoWater Absorption, ASTM D570, 48 hrs, 50°C: 0.25%Flammability Ignition, ASTM D229: 115 secFlammability Burn, ASTM D229: 15 secDielectric Strength, ASTM D149, 60 Hz, Method A, wet: 375 V/milDielectric Strength, ASTM D149, 60 Hz, Method B, wet: 350 V/milDielectric Constant, ASTM D150, 1000 Hz, wet: 4.2Dielectric Constant, ASTM D150, 1000000 Hz, wet: 3.5Dissipation Factor, ASTM D150, 1000 Hz, wet: 0.01Dissipation Factor, ASTM D150, 1000000 Hz, wet: 0.014Compression and Transfer Molding Conditions:
Preforming Pressure: 8000 to 12000 psi
Preheat Temperature: 220 to 230 °F
Preheat Time: 45 sec
Mold Temperature: 320 to 350 °F
Compression Mold Pressure: 3500 to 6000 psi
Transfer Mold Pressure: 2500 to 5000 psi
Cure Time, 0.125 in: 45 to 70 sec |