KYOCERA KE-850SP

Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound.

Strong Points

• High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress.

• Used in Auto Molding System by Rapid Cure Grades.

• KE-870 and KE-880 is Formulated with Special High Thermal Conductivity Filler System and Achieve High Thermal Conductivity (above 3W/m K).

Application

• Isolation Packages such as TO-220 and TO-3P that need Heat Dissipation Characteristics.

• Packages for High Heating Volume such as Power Module.

基本信息
特性	导热 防潮性 良好的成型性能
用途	电气/电子应用领域

物理性能	额定值	单位制
比重		g/cm³
Spiral Flow		cm

热性能	额定值	单位制
玻璃转化温度		°C
线形热膨胀系数 - 流动
-- 1		cm/cm/°C
-- 2		cm/cm/°C
导热系数		W/m/K

Uncured Properties	额定值	单位制
Gel Time		min

备注
1 .	Alpha 1
2 .	Alpha 2